Bauer Bga Software

The BGA Designer Suite automates the design of all types of BGA technologies including Wire Bonded, Flip Chip, Chip Scale, Wafer Scale, Flex, and TAB Bonded. Supports substrates: Organic, Ceramic (LTCC) and Flex. Cavity type designs, facing up or down, with any number of shelves are fully supported with optional vertical metal on the shelf edges. Build your Own Suite: The BGA Suite may also be customized by adding other products from CDS.

You can add other, and to build a design suite to fit your exact needs for a value price. Key Features: • Bond-finger / bond-wire fanout uses parametric controls for unlimited creative flexibility • Automatic creation of JEDEC or custom BGAs including reading in an MS Excel® file with Netnames and Class names initialized • Automatic and interactive Netlist Creation tools for single chips and MCMs • Support for all package types including new technologies BGA, MCM, CSP, BUM, WSP, etc. Customized Solutions Not only does CDS provide feature-rich Electronic Design Automation (EDA) layout solutions, we also consult with clients to create custom circuit design solutions to smooth out their specific development flows. Over the past 18 years, CDS has worked with customers to develop many custom software solutions. We pride ourselves in adapting the software to the customers' needs, and not asking the customer to adapt their flow to the software’s functions.

CDS also writes customer data that links to Epoxy Dispense, Die Placement and All Types of Wire Bonding Machines.

2 in 1 hot air and Infrared bga rework station BAUER OMEGA XD. 1× CD of manual and software (if not get, may be lost in customs, please contact us). May 03, 2015  where can i find software for a honton bga machine? Hi all I am new to this forum and to the bga trade, first timer actually. Garritan personal orchestra free. Software de bauer, funciona ok con la honton., 11:56 AM #3. View Profile View Forum Posts Private Message Member Join Date Sep 2014.